info@imageprocircuits.com
 
 
 
 
  Layer Count:
 
Board layer    0 - 30 layers
  Material:
 
FR4
Rogers
Arlon
Teflon
and More... " Berquist-Thermal Clad / Thermagon PCB's "
  Flex Board:
 
Rigid-Flex circuits Boards
  RoHS Certified:
 
RoHS compliance boards / WEEE directive for lead-free in electronic mfg.
  Max Board Size:
  2 - Layer
4 - Layer
6 - Layer
8 - Layer
10 - Layer
12 - Layer
14- 30 Layer
16 x 22
16 x 22
16 x 22
14 x 20
14 x 20
14 x 20
14 x 20
  Soldermask Type:
 
Carbon Screening
Peel able Mask
  LPI Soldermask Colors:
 
Green / Green Matt
Blue
Black / Black Matt
Red
Clear
White
  Silkscreen Legend Options:
 
White
Yellow
Black
Red
  Finish Plating:
 
HASL / Leaded Solder
HASL / Lead Free Solder
Bare Copper
Nickel
Electroless Nickel Immersion Gold
Immersion Silver
Immersion Electroless soft Gold
Flash Gold
White Tin
Carbon Ink
  Board Thickness:
 
Min. / Max.      .012"  to  .250"
  Traces / Spaces:
 
Tolerance is 4 mil or .004"
  Finished Cu
Weight/Traces/Space:
  Outer Layers
1 oz. Cu. - ( Min.   .004"  Trace / Space )
2 oz. Cu. - ( Min.   .006"  Trace / Space )
3 oz. Cu. - ( Min.   .010"  Trace / Space )
4 oz. Cu. - ( Min.   .012"  Trace / Space )
5 oz. Cu. - ( Min.   .012"  Trace / Space )
  Inner Layers:
 
.5 oz. Cu. - ( Min.   .004"  Trace / Space )
1 oz. Cu. - ( Min.   .005"  Trace / Space )
2 oz. Cu. - ( Min.   .006"  Trace / Space )
  Inner Layer Clearances:
 
.08"  
  CNC Functions:
 
TAB ROUTE panelization
V-Scoring Panel Edge to Panel Edge
Countersinks ( Plated / Non-Plated )
Blind or Buried Vias
Gold finger Bevel
  Other Services:
 
Plated Slots Min .012" Drilled or Routed
Controlled Impedance 2 - 16 Layers
Controlled Dielectric
Selected gold plating
Heavy Copper Plating-up to 5 oz
Differential Copper Plating-1 to 5 oz
 
**PGA,   BGA,   Micro-BGA,   and    LGA
 
  Quality and Testing:
 
Flying Probe & Fixture ( Electrical testing )
Inspect to IPC 6012 Class 2
Micro Cross Section Inspection
ISO 9001:2008 Certified